View XEC24E3-03G_8990095.PDF datasheet online --- IC-ON-LINE

Datasheet File OCR Text:

available on tape and reel for pick and place manufacturing. usa/canada: toll free: europe : (315) 432-8909 (800) 411-6596 +44 2392-232392 model x e c2 4 e 3 - 03 g rev a cc rr hybrid coupler 3 db, 90 description the XEC24E3-03G is a low profile, high performance 3 db hybrid coupler in a new easy to use, manufacturing friendly surface mo unt package. it is designed for ims band, rf heating applications in th e 2400mhz to 2500mhz range. it can be used in high power applicatio ns up to 300 watts. parts have been subjected to rigorous qualification t esting and they are manufactured using materials with coefficients of th ermal expansion (cte) compatible with common substrates such as fr4, g-10, rf -35, ro4350 and polyimide. available in 6 of 6 enig (xec24e3-03 g) rohs compliant finish. electrical specifications ** features: ? 2400-2500 mhz ? rf heating ? high power ? very low loss ? tight amplitude balance ? high isolation ? production friendly ? tape and reel frequency isolation insertion loss vswr amplitude balance mhz db min db max max : 1 db max 2400-2500 23 0.15 1.15 0.25 phase power operating temp. degrees avg. cw watts oc 90 4.0 300 -55 to +95 **specification based on performance of unit proper ly installed on anaren test board 58492-0001 with small signal applied. specifications are subject to chan ge without notice. refer to parameter definitions for details. mechanical outline
usa/canada: toll free: europe: (315) 432-8909 (800) 411-6596 +44 2392-232392 available on tape and reel for pick and place manufacturing. model x e c2 4e3 - 03 g rev a hybrid coupler pin configuration the XEC24E3-03G has an orientation marker to denote pin 1. once port one has been identified the other ports are known automatically. please see the chart below for cl arification: configuration pin 1 pin 2 pin 3 pin 4 splitter input isolated -3db 90 ? -3db splitter isolated input -3db -3db 90 ? splitter -3db 90 ? -3db input isolated splitter -3db -3db 90 ? isolated input *combiner a 90 ? a isolated output *combiner a a 90 ? output isolated *combiner isolated output a 90 ? a *combiner output isolated a a 90 ? *note: ?a? is the amplitude of the applied signals. when two quadrature signals with equal amplitudes are applied to the coupler as described in the table, the y will combine at the output port. if the amplitudes are not equal, some of the applied energy will be directe d to the isolated port.
available on tape and reel for pick and place manufacturing. usa/canada: toll free: europe : (315) 432-8909 (800) 411-6596 +44 2392-232392 model x e c2 4 e 3 - 03 g rev a insertion loss and power derating curves insertion loss derating: the insertion loss, at a given frequency, of a group of couplers is measured at 25 c and then averaged. the measurements are performed under small signal conditions (i.e. using a vector network analyzer). the process is repeated at 85 c and 150 c. a best-fit line for the measured data is computed and then plotted from -55 c to 150 c. power derating: the power handling and corresponding power derating plots are a function of the thermal resistance, mount ing surface temperature (base plate temperature), maximum continuous operating temperature of the coupler, and the thermal insertion loss. the therma l insertion loss is defined in the power handling sect ion of the data sheet. as the mounting interface temperature approaches the maximum continuous operating temperature, the power handling decreases to zero. if mounting temperature is greater than 110 c, xinger coupler will perform reliably as long as the input po wer is derated to the curve above.
usa/canada: toll free: europe: (315) 432-8909 (800) 411-6596 +44 2392-232392 available on tape and reel for pick and place manufacturing. model x e c2 4e3 - 03 g rev a typical performance (-55c, 25c, 95c & 150c): 2 400-2500 mhz
available on tape and reel for pick and place manufacturing. usa/canada: toll free: europe : (315) 432-8909 (800) 411-6596 +44 2392-232392 model x e c2 4 e 3 - 03 g rev a typical performance (-55c, 25c, 95c & 150c): 2 400-2500 mhz
usa/canada: toll free: europe: (315) 432-8909 (800) 411-6596 +44 2392-232392 available on tape and reel for pick and place manufacturing. model x e c2 4e3 - 03 g rev a definition of measured specifications parameter definition mathematical representation vswr (voltage standing wave ratio) the impedance match of the coupler to a 50 system. a vswr of 1:1 is optimal. vswr = min max v v vmax = voltage maxima of a standing wave vmin = voltage minima of a standing wave return loss the impedance match of the coupler to a 50 system. return loss is an alternate means to express vswr. return loss (db)= 20log 1 - vswr 1 vswr + insertion loss the input power divided by the sum of the power at the two output ports. insertion loss(db)= 10log direct cpl in p p p + isolation the input power divided by the power at the isolated port. isolation(db)= 10log iso in p p phase balance the difference in phase angle between the two output ports. phase at coupled port ? phase at direct port amplitude balance the power at each output divided by the average power of the two outputs. 10log ?? ? ?? ? + 2 p p p direct cpl cpl and 10log ?? ? ?? ? + 2 p p p direct cpl direct
available on tape and reel for pick and place manufacturing. usa/canada: toll free: europe : (315) 432-8909 (800) 411-6596 +44 2392-232392 model x e c2 4 e 3 - 03 g rev a notes on rf testing and circuit layout the XEC24E3-03G surface mount couplers require the u se of a test fixture for verification of rf performa nce. this test fixture is designed to evaluate the coupler in t he same environment that is recommended for installa tion. enclosed inside the test fixture, is a circuit board th at is fabricated using the recommended footprint. the part being tested is placed into the test fixture and pressure is applied to the top of the device using a pneumati c piston. a four port vector network analyzer is connected to the fixture a nd is used to measure the s-parameters of the part. worst case values for each parameter are found and compared to the specification. these worst case values are repo rted to the test equipment operator along with a pass or fa il flag. see the illustrations below. 3 db and 5db test board test board in fixture test station
usa/canada: toll free: europe: (315) 432-8909 (800) 411-6596 +44 2392-232392 available on tape and reel for pick and place manufacturing. model x e c2 4e3 - 03 g rev a the effects of the test fixture on the measured data must be minimized in order to accurately determine the performance of the device under test. if the line imp edance is anything other than 50 and/or there is a discontinuity at the microstrip to sma interface, there will be err ors in the data for the device under test. the test environment can never be ?perfect?, but the procedure used to build a nd evaluate the test boards (outlined below) demons trates an attempt to minimize the errors associated with testing these devices. the lower the signal level that is b eing measured, the more impact the fixture errors will ha ve on the data. parameters such as return loss and isolation/directivity, which are specified as low as 27 db and typically measure at much lower levels, will pre sent the greatest measurement challenge. the test fixture errors introduce an uncertainty to th e measured data. fixture errors can make the performa nce of the device under test look better or worse than it actuall y is. for example, if a device has a known return loss of 30db and a discontinuity with a magnitude of ?35db is introduce d into the measurement path, the new measured retur n loss data could read anywhere between ?26db and ?37db. thi s same discontinuity could introduce an insertion phase error of up to 1 . there are different techniques used throughout the i ndustry to minimize the effects of the test fixture on the measurement data. anaren uses the following design and de-embedding criteria: ? test boards have been designed and parameters speci fied to provide trace impedances of 50 1 . furthermore, discontinuities at the sma to microstr ip interface are required to be less than ?35db and insertion phase errors (due to differences in the connector interface discontinuities and the electrical line length) should be less than 0.50 from the median value of the four paths. ? a ?thru? circuit board is built. this is a two port, microstrip board that uses the same sma to microstrip interface and has the same total length (i nsertion phase) as the actual test board. the ?thru? board must meet the same stringent requireme nts as the test board. the insertion loss and insertion phase of the ?thru? board are measure d and stored. this data is used to completely de-embed the device under test from the tes t fixture. the de-embedded data is available in s-parameter form on the anaren website (www.anaren.com). note : the s-parameter files that are available on the anaren.com website include data for frequencies that are outside of the specified band. it is important to no te that the test fixture is designed for optimum pe rformance through 2.3ghz. some degradation in the test fixture perform ance will occur above this frequency and connector interfa ce discontinuities of ?25db or more can be expected. thi s larger discontinuity will affect the data at frequen cies above 2.3ghz. circuit board layout the dimensions for the anaren test board are shown below. the test board is printed on rogers ro4003 m aterial that is 0.032? thick. consider the case when a different material is used. first, the pad size must remain the same to accommodate the part. but, if the material thickness or dielectric constant (or both) changes, the reactance at the interface to the coupler will also change. second, the linewidth required for 50 will be different and this will introduce a step in the line at the pad where the coupler inte rfaces with the printed microstrip trace. both of thes e conditions will affect the performance of the part. to achieve the specified performance, serious atten tion must be given to the design and layout of the circuit environment in whi ch this component will be used. if a different circuit board material is used, an att empt should be made to achieve the same interface pad reactance that is present on the anaren ro4003 test board. wh en thinner circuit board material is used, the groun d plane will be closer to the pad yielding more capacitance for the same size interface pad. the same is true if the diel ectric constant of the circuit board material is higher than is used on the anaren test board. in both of these cases, narrowing the line before the interface pad will int roduce a series inductance, which, when properly tuned, will compensate for the extra capacitive reactance. if a thic ker circuit board or one with a lower dielectric constan t is used,
available on tape and reel for pick and place manufacturing. usa/canada: toll free: europe : (315) 432-8909 (800) 411-6596 +44 2392-232392 model x e c2 4 e 3 - 03 g rev a the interface pad will have less capacitive reactance th an the anaren test board. in this case, a wider sectio n of line before the interface pad (or a larger interface pad) will introduce a shunt capacitance and when properly tun ed will match the performance of the anaren test board. notice that the board layout for the 3db and 5db coupl ers is different from that of the 10db and 20db coup lers. the test board for the 3db and 5db couplers has all four traces interfacing with the coupler at the same angl e. the test board for the 10db and 20db couplers has two traces a pproaching at one angle and the other two traces at a different angle. the entry angle of the traces has a significant imp act on the rf performance and these parts have been optimized for the layout used on the test board s shown below. 58492-0001 rev.b w=64.0 2.000 1.753 .450 .090 .025 ?.031 thru hole 3 db and 5db test board testing sample parts supplied on anaren test boards if you have received a coupler installed on an anaren produced microstrip test board, please remember to re move the loss of the test board from the measured data. the l oss is small enough that it is not of concern for retur n loss and isolation/directivity, but it should certainly be consid ered when measuring coupling and calculating the inser tion loss of the coupler. an s-parameter file for a ?thru? boa rd (see description of ?thru? board above) will be s upplied upon request. as a first order approximation, one should consider the following loss estimates: frequency band avg. ins. loss of test board @ 25 c 869-894 mhz ~0.064db 925-960 mhz ~0.068db 1805-1880 mhz ~0.119db 1930-1990 mhz ~0.126db 2110-2170 mhz ~0.136db the loss estimates in the table above come from room temperature measurements. it is important to note that the loss of the test board will change with temperature. this fact must be considered if the coupler is to be evaluated at other temperatures.
usa/canada: toll free: europe: (315) 432-8909 (800) 411-6596 +44 2392-232392 available on tape and reel for pick and place manufacturing. model x e c2 4e3 - 03 g rev a peak power handling high-pot testing of these couplers during the qualif ication procedure resulted in a minimum breakdown vol tage of 1.72kv (minimum recorded value). this voltage level co rresponds to a breakdown resistance capable of handlin g at least 12db peaks over average power levels, for ver y short durations. the breakdown location consistently o ccurred across the air interface at the coupler contact pads (see illustration below). the breakdown levels at these p oints will be affected by any contamination in the gap area aroun d these pads. these areas must be kept clean for optimu m performance. it is recommended that the user test for voltage breakdown under the maximum operating conditi ons and over worst case modulation induced power peaking. this evaluation should also include extreme environme ntal conditions (such as high humidity). orientation marker a printed circular feature appears on the top surface o f the coupler to designate pin 1. this orientation m arker is not intended to limit the use of the symmetry that these couplers exhibit but rather to facilitate consistent placement of these parts into the tape and reel package. this ensur es that the components are always delivered with the sa me orientation. refer to the table on page 2 of the da ta sheet for allowable pin configurations. test plan xinger couplers are manufactured in large panels and then separated. all parts are rf small signal test ed and dc tested for shorts/opens at room temperature in the fixture described above. (see ?qualification flow char t? section for details on the accelerated life test procedures.)
available on tape and reel for pick and place manufacturing. usa/canada: toll free: europe : (315) 432-8909 (800) 411-6596 +44 2392-232392 model x e c2 4 e 3 - 03 g rev a power handling the average power handling (total input power) of a xinger coupler is a function of: ? internal circuit temperature. ? unit mounting interface temperature. ? unit thermal resistance ? power dissipated within the unit. all thermal calculations are based on the following a ssumptions: ? the unit has reached a steady state operating conditi on. ? maximum mounting interface temperature is 95 o c. ? conduction heat transfer through the mounting inter face. ? no convection heat transfer. ? no radiation heat transfer. ? the material properties are constant over the opera ting temperature range. finite element simulations are made for each unit. the simulation results are used to calculate the unit thermal resistance. the finite element simulation requires the following inputs: ? unit material stack-up. ? material properties. ? circuit geometry. ? mounting interface temperature. ? thermal load (dissipated power). the classical definition for dissipated power is temp erature delta ( ? t) divided by thermal resistance (r). the dissipated power (p dis ) can also be calculated as a function of the total inp ut power (p in ) and the thermal insertion loss (il therm ): ) ( 10 1 10 w p r t p therm il in dis ? ?? ? ? ?? ? ? ? = ? = ? (1) power flow and nomenclature for an ?x? style coupler i s shown in figure 1.
usa/canada: toll free: europe: (315) 432-8909 (800) 411-6596 +44 2392-232392 available on tape and reel for pick and place manufacturing. model x e c2 4e3 - 03 g rev a pin 1 pin 4 input port coupled port direct port isolated port p in p out (rl) p out (iso) p out (cpl) p out (dc) figure 1 the coupler is excited at the input port with p in (watts) of power. assuming the coupler is not ideal , and that there are no radiation losses, power will exit the coupler at a ll four ports. symbolically written, p out(rl) is the power that is returned to the source because of impedance mismatch, p out(iso) is the power at the isolated port, p out(cpl) is the power at the coupled port, and p out(dc) is the power at the direct port. at anaren, insertion loss is defined as the log of t he input power divided by the sum of the power at th e coupled and direct ports: note: in this document, insertion loss is taken to be a positive number. in many places, insertion loss i s written as a negative number. obviously, a mere sign change equat es the two quantities. ) db( p p p log 10 il ) dc ( out ) cpl ( out in 10 ? ?? ? ? ?? ? + ? = (2) in terms of s-parameters, il can be computed as follo ws: ) db( s s log 10 il 2 41 2 31 10 ?? ? ?? ? + ? ? = (3) we notice that this insertion loss value includes th e power lost because of return loss as well as power lost to the isolated port. for thermal calculations, we are only interested in th e power lost ?inside? the coupler. since p out(rl) is lost in the source termination and p out(iso) is lost in an external termination, they are not be included in the insertion loss for thermal calculations. therefore, we define a new ins ertion loss value solely to be used for thermal calcu lations:
available on tape and reel for pick and place manufacturing. usa/canada: toll free: europe : (315) 432-8909 (800) 411-6596 +44 2392-232392 model x e c2 4 e 3 - 03 g rev a ) ( log 10 ) ( ) ( ) ( ) ( 10 db p p p p p il rl out iso out dc out cpl out in therm ? ?? ? ? ?? ? + + + ? = (4) in terms of s-parameters, il therm can be computed as follows: ) ( log 10 2 41 2 31 2 21 2 11 10 db s s s s il therm ?? ? ?? ? + + + ? ? = (5) the thermal resistance and power dissipated within th e unit are then used to calculate the average total i nput power of the unit. the average total steady state input p ower (p in ) therefore is: ) ( 10 1 10 1 10 10 w r t p p therm therm il il dis in ? ?? ? ? ?? ? ? ? = ? ?? ? ? ?? ? ? = ? ? (6) where the temperature delta is the circuit temperatu re (t circ ) minus the mounting interface temperature (t mnt ): ) ( c t t t o mnt circ ? = ? (7) the maximum allowable circuit temperature is defined by the properties of the materials used to construct t he unit. multiple material combinations and bonding techniques are used within the xinger product family to optimize rf performance. consequently the maximum allowable circuit temperature varies. please note that the circuit temperature is not a function of the xinger case (top surface) temperature. therefore, the case temperatur e cannot be used as a boundary condition for power handling cal culations. due to the numerous board materials and mounting co nfigurations used in specific customer configurations, it is the end users responsibility to ensure that the xinger co upler mounting interface temperature is maintained w ithin the limits defined on the power derating plots for the required average p ower handling. additionally appropriate solder composition is required to prevent reflow or fatigue failure at the rf ports. finally, reliabili ty is improved when the mounting interface and rf port temperatures are kept to a minimum. the power-derating curve illustrates how changes in t he mounting interface temperature result in converse changes of the power handling of the coupler.
usa/canada: toll free: europe: (315) 432-8909 (800) 411-6596 +44 2392-232392 available on tape and reel for pick and place manufacturing. model x e c2 4e3 - 03 g rev a mounting in order for xinger surface mount couplers to work optimally, there must be 50 transmission lines leading to and from all of the rf ports. also, there must be a very good ground plane underneath the part to ensur e proper electrical performance. if either of these two conditions is not satisfied, electrical performance may not meet published specifications. overall ground is improved if a dense population of plated through holes connect the top and bottom groun d layers of the pcb. this minimizes ground inductance and improves ground continuity. all of the xinger hyb rid and directional couplers are constructed from ceramic filled ptfe composites which possess excellent electrical and mechanical stability having x and y thermal coefficient of expansion (cte) of 17-25 ppm/ o c. when a surface mount hybrid coupler is mounted to a printed circuit board, the primary concerns are; ensur ing the rf pads of the device are in contact with the circui t trace of the pcb and insuring the ground plane of ne ither the component nor the pcb is in contact with the rf signal. mounting footprint cc rr .450 [11.43] 4x .025 [0.64] 4x 50 transmission line .090 [2.29] multiple plated thru holes to ground dimensions are in inches [millimeters] XEC24E3-03G mounting footprint to ensure proper electrical and thermal performance there must be a ground plane with 100% solder connection underneath part orientated as shown with text facin g up coupler mounting process the process for assembling this component is a conventional surface mount process as shown in figure 1. this process is conducive to both low and high volume usage. figure 1: surface mounting process steps storage of components: the xinger products are available in either an immersion tin or tin-lead fi nish. commonly used storage procedures used to control oxidation should be followed for these surface mount components. the storage temperatures should be held between 15 o c and 60 o c. substrate: depending upon the particular component, the circuit material has an x and y coefficient of ther mal expansion of between 17 and 25 ppm/c. this coeffici ent minimizes solder joint stresses due to similar expan sion rates of most commonly used board substrates such as rf35, ro4003, fr4, polyimide and g-10 materials. mounting to ?hard? substrates (alumina etc.) is possib le depending upon operational temperature requirements . the solder surfaces of the coupler are all copper plat ed with either an immersion tin or tin-lead exterior f inish. solder paste: all conventional solder paste formulations will work well with anaren?s xinger surface mount components. solder paste can be applied with stencils or syringe dispensers. an example of a stenciled solder paste deposit is shown in figure 2. as shown in th e figure solder paste is applied to the four rf pads and the entire ground plane underneath the body of the part.
available on tape and reel for pick and place manufacturing. usa/canada: toll free: europe : (315) 432-8909 (800) 411-6596 +44 2392-232392 model x e c2 4 e 3 - 03 g rev a figure 2: solder paste application coupler positioning: the surface mount coupler can be placed manually or with automatic pick and place mechanisms. couplers should be placed (see figure 3 and 4) onto wet paste with common surface mount techniques and parameters. pick and place systems must supply adequate vacuum to hold a 0.106 gram coupler. figure 3: component placement figure 4: mounting features example reflow: the surface mount coupler is conducive to most of today?s conventional reflow methods. low and high temperature thermal reflow profiles are shown in fi gures 5 and 6, respectively. manual soldering of these compon ents can be done with conventional surface mount non-contact hot air soldering tools. board pre-heating is highl y recommended for these selective hot air soldering methods. manual soldering with conventional irons s hould be avoided.
usa/canada: toll free: europe: (315) 432-8909 (800) 411-6596 +44 2392-232392 available on tape and reel for pick and place manufacturing. model x e c2 4e3 - 03 g rev a figure 5 ? low temperature solder reflow thermal pr ofile figure 6 ? high temperature solder reflow thermal p rofile
available on tape and reel for pick and place manufacturing. usa/canada: toll free: europe : (315) 432-8909 (800) 411-6596 +44 2392-232392 model x e c2 4 e 3 - 03 g rev a qualification flow chart visual inspection n=50 mechanical inspection n=40 solderability test n=5 initial rf test n=45 solder units to test board n=20 post sol der visual inspection n=20 initial rf test board mounted over temp n=20 visual inspection n=40 automated test operation n=45 thermal shock n=40 post shock rf test n=40 moisture resistance n=40 reflow / resistance to solder heat n=20 (loose) bak e units n=40 microsection n = 2 visual inspection n=40 life test n=3 final rf test n=3 rf test n = 20 (loose), n = 20 (mounted over temp) voltage breakdown n=10 visual inspection n=10 rf test n=10 microsection n = 1 loose control, n = 1 mounted control, n = 3 board mounted, n = 3 loose visual inspection n=45 pim test n=5
usa/canada: toll free: europe: (315) 432-8909 (800) 411-6596 +44 2392-232392 available on tape and reel for pick and place manufacturing. model x e c2 4e3 - 03 g rev a packaging and ordering information parts are available in a reel and as loose parts in a bag. packaging follows eia 481-d for reels. parts are oriented in tape and reel as shown below. .591 [15.00] .228 [5.80] .945 [24.00] .453 [11.50] .069 [1.75] .079 [2.00] .157 [4.00] .012 [0.30] .094 [2.40] ?.059 [?1.50] section a-a .315 [8.00] direction of part feed (unloading) a a dimensions are in inches [mm] ?.059 [?1.50] b ?a ?c table 1: reel dimensions (mm) XEC24E3-03Gr XEC24E3-03Gr1 quantity/reel ?a ?c ?d b 2000 250 330.00 177.80 24.0 24.0 102.03 50.80 13.00 13.00

▲Up To Search▲

Price & Availability of XEC24E3-03G

	To Download XEC24E3-03G Datasheet File
If you can't view the Datasheet, Please click here to try to view without PDF Reader .